Aluminum Nitride Sheet,Alumina Ceramic Sheet Suppliers|huaqingcn.com

AlN Ceramic substrate TO220 package

The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.

Hot Tags : Aluminum Nitride Ceramic TO220 TO220 AlN substrate Aluminum nitride for TO220 AlN ceramic used for TO220 package TO220 Package of Aluminum nitride Ceramic AlN of TO220
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AMB ceramic substrate for Power Modules

AMB(Active Metal Brazing Substrate) is the further development of DBC technology. It is a method to use a small amount of active elements such as Ti and Zr contained in the filler metal to react with ceramics to form a reaction layer that can be wetted by liquid solder, so as to realize the bonding between ceramics and metals. AMB is combined by chemical reaction between ceramic and active metal solder at high temperature, so its bonding strength is higher and its reliability is better. 1.Material:Aluminum Nitride/Alumina/ZTA/Si3N4. 2.Function:Insulation and heat dissipation ceramics. 3.Type:Metallized ceramic. 4.Can be customed:yes,please provide drawings for specific products.

Hot Tags : Ceramic AMB substrate ALN AMB substrate AMB substrates Active Metal Brazing (AMB) Technology Ceramic Substrates Ceramic plate Ceramic substrate
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DBC ceramic Substrate for power electronic

DBC (Direct Bonding Copper) is the direct mating of two dissimilar electronic materials (Copper and Ceramic). The interface between the pure copper and the ceramic is very reliable. 1.Material:Aluminum Nitride/Alumina/ZTA/Si3N4. 2.Function:Insulation and heat dissipation ceramics. 3.Type:Metallized ceramic. 4.Can be customed:yes,please provide drawings for specific products.

Hot Tags : Direct Bond Copper Substrates DBC substrate Al203 DBC substrate AlN DBC ceramic DBC ZTA substrate Si3N4 DBC ceramic
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DBC Ceramic Substrates for Semiconductor

The Direct Bond Copper is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

Hot Tags : DBC Ceramic Substrate DBC Semiconductor Aluminum Nitride Ceramic Metalizaion Ceramic Al2O3 ceramic Direct Bonded Copper
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Polished AlN Aluminum Nitride Ceramic Sheet High Thermal Conductivity

Aluminum Nitride Ceramic Substrate has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. Product Details: Material: Aluminum Nitride. Fuction: Insulating and heat dissipation ceramic. Type: Ceramic. Color: Gray. Can be customed: Yes, Please provide drawings of specific products.

Hot Tags : aln thermal conductivity Aluminum nitride wafer Aluminum Nitride Ceramic Polished aluminum nitride ceramics AlN Ceramic Sheet Aluminum Nitride
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Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules

The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

Hot Tags : Metalization Ceramic DBC Ceramic Substrate Semiconductor Direct Bonded Copper AlN DBC ceramic Al2O3 DBC Ceramic DBC Substrate Semiconductor
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High Temperature Insulator Aluminum Nitride(AlN) Ceramic Plate Substrate

Aluminum Nitride(AlN) is a high thermal conductivity dielectric insulator ceramic. It provides the same high thermal and electrical performance as beryllium oxide at a more economical cost without toxicity concerns. Product Details: Material: Aluminum Nitride. Function: Insulation and heat dissipation device. Color: Gray. Type: Ceramic. Can be customed: Yes, please provide drawings of specifi products.

Hot Tags : Insulator AlN Ceramic Substrate AlN Ceramic High Temperature AlN Plate Aluminum Nitride Ceramic Substrate AlN Insulator Substrate Aluminum Nitride Plate
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Semiconductor Aluminum Nitride(AlN) Ceramic Equipment Slotted Disc

Aluminum Nitride (AlN) Ceramics are electrically insulating and have excellent thermal conductivity, making them ideal for applications where heat dissipation is required. Product Details: Material: Aluminum Nitride Function: Insulating and heat dissipation device. Type: Ceramic. Color: Gray. Can be customed: Yes, please provide drawings of specific products.

Hot Tags : AlN Ceramic Sheet Semiconductor Semiconductor AlN Plate AlN Slotted Disc AlN Ceramic Substrate Aluminum Nitride Ceramic Disc Aluminum nitride wafer
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High Density Machining Alumina Ceramic Substrates

Alumina ceramic substrate is one of the most popular ceramic substrates because of its excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. Product Details: Material: Aluminum Oxide Function: Insulation device. Color: White. Type: Ceramic. Can be customed: Yes, please provide drawings of specific products.

Hot Tags : Alumina Ceramic Substrates Machining Al2O3 Ceramic High Density Al2O3 Ceramic Al2O3 sheet Aluminum Oxide Substrates High Purity Alumina Ceramic
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Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules

Active Metal Brazing(AMB) substrates rely on a chemical reaction between the ceramic and the active metal solder paste at high temperatures to achieve bonding, which results in higher bond strength and better reliability. Product Details: Material: Aluminum Nitride/Alumina/ZTA/Si3N4. Function: Type: Can be customed: Yes, please provide drawings of specific products.

Hot Tags : Active Metal Brazing Ceramic Substrate AMB substrates IGBT AMB ALN AMB substrate ZTA AMB Ceramic Active Metal Brazing Technology Ceramic Substrate
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Metalized Direct Bonding Copper(DBC) AlN/Al2O3/ZTA Ceramic sheet

Direct Bond Copper (DBC) ceramic substrate is a new type of composite material in which highly insulating Alumina (Al2O3) or Aluminum Nitride (AlN) ceramic substrates are laminated with copper metal. Product Details: Material: Aluminum Nitride/Alumina/ZTA/Si3N4. Function: Insulating and heat dissipation ceramic. Type: Metalized ceramic. Can be customed: Yes, please provide drawings of specific products.

Hot Tags : Metalized Ceramic Sheet DBC Ceramic for Electric vehicle EV DBC Ceramic Direct Bond Copper Substrates AlN DBC ceramic Al2O3 DBC Substrate
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99.9% High Purity Alumina Ceramic Substrates for Semiconductor

Aluminum Oxide(Al2O3) has extremely high hardness, high temperature resistance and insulation, so it is widely used in all kinds of high precision equipment. Our alumina substrate has well-balanced properties of insulation, thermal conductivity and breaking strength. Product Details: Material: Aluminum Oxide. Function: Insulating device ceramic. Color: White. Type: Ceramic. Can be customized: Yes, please provide drawings of specific products.

Hot Tags : High Purity Alumina Ceramic 99.9% Alumina Ceramic 99.9% Alumina Semiconductor 99.9% Al2O3 Substrates Semiconductor Al2O3 Ceramic High Purity 99.9% Alumina
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