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Aluminum Nitride Ceramic Substrate
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Ceramic Aluminum Nitride Direct Wafer Bonding

AlN-coated wafers

Ceramic Aluminum Nitride Direct Wafer Bonding

1.Material:Aluminum Nitride.

2.Function:Insulation and heat dissipation ceramic.

3.Type:Ceramic.

4.Color:Gray.

5.Can be customed:yes,please provide drawings for specific products.

Ceramic Aluminum Nitride Direct Wafer Bonding

Product Description:

There is a method was developed for the direct wafer-to-wafer bonding of aluminum nitride(AlN) to AlN-coated wafers.Direct wafer bonding requires smooth, flat, hydrophilic surfaces that are able to be activated with appropriately charged hydrogen molecules on the prepared surfaces.Huaqing can provide AlN substrate with very smooth(Ra≤0.03um) and flat surface.

Our Aluminum Nitride substrates (AlN) are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.

Our Service:
Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK

Specification:

Dimension (LxW) φ50.8mm,φ101.6mm etc.
Thickness 0.38-2.0 mm
Thermal Conductivity 170-230W/m.K
Dielectric Constant 8-9 (MHz)
Bulk Density 3.3 g/cm³
Surface Roughness Ra ≤0.03 μm on both sides

Company Advantage:

Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.

Workshop & Equipment:

Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc

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    Contact Information
    • Visit Our Company at: Address: No.2,Lingshi Road,Wuli Industry zone,Jinjiang City,Fujian Province,China
    • Have a Questions? Call Us +86 -15960789288
    • Contact with Us kevinsze@aln.net.cn
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