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AlN Ceramic substrate TO220 package

TO220 AlN Ceramic

AlN Ceramic substrate TO220 package

The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

1.Material:Aluminum Nitride.

2.Function:Insulation and heat dissipation ceramic.

3.Type:Ceramic.

4.Color:Gray.

5.Can be customed:yes,please provide drawings for specific products.

AlN Ceramic substrate TO220 package

Product Description:

The TO-220 is commonly used for housing transistors, thyristors, and integrated circuits with low lead counts. 

Our Aluminum Nitride substrates (AlN) are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.

Our Service:
Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK

Specification:

Dimension (LxW) 18*13mm,18*12mm etc.
Thickness 0.635/1.0 mm
Thermal Conductivity 170W/m.K
Dielectric Constant 8-9 (MHz)
Bulk Density 3.3 g/cm³
Surface Roughness Ra < 0.6 μm on both sides

Company Advantage:

Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.

Workshop & Equipment:

 

 

 

 

Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc

 

 

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    Learn More
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    Learn More
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    Learn More
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    Learn More
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    Learn More
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    Learn More
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    Learn More
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    Learn More
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    Learn More
  • The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.

    Learn More
  • The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.

    Learn More
  • The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.

    Learn More
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