The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
1.Material:Aluminum Nitride.
2.Function:Insulation and heat dissipation ceramic.
3.Type:Ceramic.
4.Color:Gray.
5.Can be customed:yes,please provide drawings for specific products.
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