The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic.
Product Details:
Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules
Product Description:
Direct Bond Copper substrates signify a process in which ceramic material and copper are bonded together at a high temperature. DBC ceramic substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules.
Increasing applications of power modules in various fields such as industrial, automotive and transportation, and consumer devicces are expected to fuel the expansion of the global market in the coming years.
Our Service:
Please contact us for customization.
Specification:
| Copper/Ceramic/Copper specification（mm） | ||||||
| AlN-DBC | 0.25/0.38/0.25 | 0.30/0.38/0.30 | 0.25/0.64/0.25 | 0.30/0.64/0.30 | ||
| Al2O3-DBC | 0.20/0.38/0.20 | 0.25/0.38/0.25 | 0.3/0.38/0.30 | 0.20/0.64/0.20 | 0.25/0.64/0.25 | 0.30/0.64/0.30 |
| ZTA-DBC | 0.20/0.32/0.20 | 0.25/0.32/0.25 | 0.30/0.32/0.30 | |||
Company Advantage:
Huaqing founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Packaging & Delivery:
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The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
Learn More
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Aluminum Nitride/ Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
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