The Direct Bond Copper is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic.
Product Details:
DBC Ceramic Substrates for Semiconductor
Product Description:
Direct Bond Copper Substrate are used a special process in which the copper foil and the Al2O3 are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits, power hybrid circuit.
Our Service:
Please contact us for customization.
Specification:
Copper/Ceramic/Copper specification(mm) | ||||||
Al2O3-DBC | 0.20/0.38/0.20 | 0.25/0.38/0.25 | 0.3/0.38/0.30 | 0.20/0.64/0.20 | 0.25/0.64/0.25 | 0.30/0.64/0.30 |
ZTA-DBC | 0.20/0.32/0.20 | 0.25/0.32/0.25 | 0.30/0.32/0.30 |
Company Advantage:
Huaqing founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Packaging & Delivery:
Deliver by UPS, DHL, Fedex etc.
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