Why you need our services, you know you're getting highly qualified professionals who have the expertise and experience to make sure your project is done properly and functions.
As an important new material, electronic ceramics are the core materials of passive electronic components and an important technological frontier in the field of electronic information technology. With the increasing integration, intelligence and miniaturization of electronic information technology, passive electronic components have increasingly become the bottleneck of the development of electronic component technology, and the strategic position of electronic ceramic materials and their preparation and processing technology has become increasingly prominent.
With the further development of electronic information products to broadband, miniaturization, integration, mobile, green, multi-functional, multi-layer, multi-layer component chip and chip component integration of electronic ceramic components has become the mainstream of development, these new trends put forward a series of new requirements for electronic ceramic materials, such as material microstructure fine crystallization, material function diversification, electromagnetic characteristics of high frequency and low loss, etc.
Related material technology has increasingly become a bottleneck technology restricting the development of information technology. In the next few years, the key technical problems to be solved in the development of electronic ceramic materials include the following aspects.
● New electronic ceramic materials and their key technologies that meet the miniaturization/miniaturization of electronic components in electronic information systems. Such as nanocrystalline material preparation technology, ultra-thin ceramic film molding process, etc.; Ultra-low loss dielectric ceramic materials for key microwave components in low-energy wireless/mobile information systems.
● New electronic ceramic materials adapted to the characteristic frequency of the new generation of mobile communication technology. With the development of 5G/6G technology, the communication frequency band is gradually advancing from microwave to millimeter wave, and the demand for new electronic ceramics adapted to higher frequency bands, especially ceramic dielectric materials, will increase sharply, and the development of related materials and devices is imminent.
● New electronic ceramic materials for passive component integration and passive – active integration and modularization. The passive integration technology based on LTCC technology will have greater room for development, and various functional ceramic materials and their co-firing technology compatible with this technology are a technical bottleneck that needs to be overcome urgently.
● New function electronic ceramic materials for multi-function electronic information systems. New multifunctional ceramic material systems with electrical, magnetic, optical, thermal coupling behavior and extraordinary electromagnetic properties, as well as new information functional ceramic materials with stability and excellent service behavior when working in complex external fields or extreme environmental conditions.
● Other technical fields also put forward new requirements for electronic ceramic materials. In terms of energy materials, the further development of solid-state fuel cells, solar cells and semiconductor lighting technologies depends on the breakthrough of electronic ceramic materials and their preparation technologies; With the rise of the Internet of Things and sensor networks, a wide variety of sensors with different functions require the emergence of more and higher performance new sensitive ceramic materials.
◆Analysis of key development direction◆
01 A new generation of electronic ceramic components and materials
Focus on breaking through the high-end electronic ceramic material technology required by passive electronic components with a wide range of volumes, such as MLCCs, chip inductors, and ceramic filter devices, and develop material formulas and large-scale production technologies with independent intellectual property rights to form a stable production scale. Focus on breaking through the key technology and equipment for precision molding and processing of materials in high-end electronic ceramic components, ensure the independent and stable supply of key nano-ceramic materials required for thinning multilayer ceramic technology, and form independent research and development and production capacity of passive integrated key equipment.
● High-performance, low-cost MLCC materials and components
Strengthen high-performance anti-reduction ceramic media powder materials and large-scale production; Focus on the research and development of thin-type functional ceramic molding technology and equipment, nanocrystalline ceramic sintering technology, ultra-thin multi-layer ceramic structure electrode technology, etc.
● New chip inductive elements and key materials
Strengthen high-performance low-temperature sintered ferrite and low-dielectric and low-loss ceramic dielectric powder materials and large-scale production; Research and development of multilayer ceramic precision interconnection technology and equipment, miniaturized microwave-band chip inductor wiring design technology, etc.
● High-performance multilayer chip sensitive components and materials
Focus on the large-scale production technology of high-performance chip thermal, gas-sensitive, moisture-sensitive, pressure-sensitive and photosensitive ceramics, and the preparation technology and characterization technology of micro-nano-scale multilayer chip sensitive ceramic sensors.
● High-performance piezoelectric ceramic materials
Focus on the net size molding and processing of piezoelectric ceramic materials and their industrialization technology, the preparation and industrialization technology of high-performance multilayer piezoelectric materials for piezoelectric micro power applications, and the advanced preparation technology of high-performance multi-layer lead-free piezoelectric ceramic materials and new components that can be engineered and industrialized.
● A new generation of electromagnetic dielectric ceramic materials
Facing the new electromagnetic dielectric materials of 5G/6G communication technology, we focus on the research of chip high-frequency and low-loss microwave dielectric ceramics and their large-scale production technology, chip high-performance and low-cost composite electromagnetic dielectric ceramics and their basic materials large-scale production technology and equipment, artificial chip electromagnetic wave dielectric design, preparation and large-scale production technology.
02 Passive integration modules and key materials and technologies
The passive integration technology can enter the stage of practical application and industrialization, which largely depends on the breakthrough of LTCC technology. At present, although some passive integration technologies with different advantages have been developed, the mainstream technology is still LTCC. On the one hand, optimize the LTCC performance and preparation method of the material, and increase the proportion of international high-end applications; On the other hand, taking into account other types of passive integration technologies, research and development of corresponding key materials, key technologies and important modules.
● Research on electromagnetic dielectric materials for serialized LTCC Focus on the research of ceramic material powders and production belts with serialized dielectric constant and magnetic permeability, which meet LTCC performance and process requirements, and form China's independent intellectual property rights in the field of LTCC materials. ● Research on key preparation processes of passive integrated modules Focus on several key processes of passive integrated module preparation, such as thick film and film preparation process, microporous pore forming and grouting process, precision conductor paste printing process, ceramic co-firing process, etc. ● Passive integrated module design and testing method The research content includes the development of passive integrated module design software, the simulation and simulation of new passive integrated structural characteristics, the design of highly integrated passive integrated modules, and the testing technology of passive integrated modules.
Summary China's electronic ceramic materials and components field has formed a good industrial technology foundation, but electronic ceramics as an important class of strategic new materials, its strong development in the field of high-end electronic ceramics is still constrained by some key material technology, process technology and equipment technology. In order to achieve the leading development of China's high-end electronic ceramics industry, it is urgent to improve the strategic planning of electronic ceramics.
This article is reprinted from Advanced Ceramics Exhibition
Why you need our services, you know you're getting highly qualified professionals who have the expertise and experience to make sure your project is done properly and functions.
if you would like a free consultation, please start bg completing the form:
Receive Sale Info, News, and Updates in Your Inbox.